TEL 263 — Lithography for Nanofabrication
This course covers all aspects of advanced lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first section describes the advanced lithographic process from substrate preparation to exposure. Most of the emphasis is on understanding the nature and behavior of photoresist materials. The second section examines systems and techniques that define patterns. This section will introduce specialized optical masks and reticles, aligners, steppers and scanners. In addition, critical dimension (CD) control and profile control of photoresist will be investigated. The last section will discuss advanced optical lithographic techniques such as phase shifting masks and illumination schemes as well as e-beam, e-ray, EUV, and ion beam lithography. A section about engineering dielectrics is also discussed.