SMT214 — Lithography for Nanofab
Covers all aspects of lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first section describes the lithographic process from substrate preparation to exposure. Most of the emphasis will be on understanding then nature and behavior of photoresist materials. The second section examines the process from development through inspection (both before and after pattern transfer). This section will introduce optical masks, aligners, steppers and scanners. In addition, critical dimension (CD) control and profile control of photoresists will be investigated. The last section will discuss advanced optical lithographic techniques such as phase shifting masks and illumination schemes as well as e-beam, e-ray, EUV, and ion beam lithography.
Prerequisites: CHE108, BIO112, BGT110, SMT216, SMT215, SMT213, SMT212, SMT211, PHY110, MAT130, ENG107, ENG105, ELE210, ELE165, ELE130, ELE120, SMT214L