EMEC 467 — Micro-Electromechanical Systems: 3 Credits (3 Lec)

(Sp) Introduction to sensors and actuators and their working principles. MEMS (microelectromechanical systems) fabrication procedures. MEMS materials and their mechanical properties. Mechanical behavior of microsystems. MEMS packaging and thermal-mechanical stresses in MEMS packages. Reliability issues in MEMS. MEMS case studies using FEM in Comsol in an extended project work

Prerequisites: EELE 250, EGEN 205

Part of

• Minor in Aerospace (Non-Teaching)
• Minor in Materials (Non-Teaching)

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